国家/地区 世界知识产权组织（7）
IPC部 C（7）
IPC大类 C09（7） H01（3） H05（3）
C08（2）
IPC小类 C09J（7） H01L（3） H05K（3）
C08K（2）
IPC C09J201/00（7）
发明人 DAISUKE T（3） GINJI M（3） ICHIKAWA I（3）
ISAO I（3） TAKEO Y（3） TOMOHARU K（3）
YOSHINOBU T（3）
公开年 2022（4） 2023（3）
申请年 2021（3）  2022（3） 
专利权人 LINTEC CORP（3） NITTO DENKO .（3）

Pressure-sensitive adhesive composition used for electrical peeling and in pressure-sensitive adhesive sheet e.g. for mobile terminals such as smart phones, and video cameras, and joined body, comprises polymer and ionic liquid, where polymer as base polymer and further comprising another polymer.

DAISUKE T, GINJI M, TOMOHARU K

Pressure-sensitive adhesive composition used for electrical peeling and in pressure-sensitive adhesive sheet and joined body, where adhesive sheet used for e.g. mobile terminals such as smartphones, comprises polymer, ionic liquid, and tackifier.

TOMOHARU K, GINJI M, DAISUKE T

Pressure-sensitive adhesive composition used for electrical peeling and in pressure-sensitive adhesive sheet and joined body, where adhesive sheet used for e.g. mobile terminals such as smartphones, comprises polymer, ionic liquid, and tackifier having specific hydroxyl value.

TOMOHARU K, GINJI M, DAISUKE T

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Hybrid adhesive composition useful for electromagnetic wave shielding, comprises conductive metal particles, graphene, adhesive resin and curing agent, where graphene is chemically modified graphene, and adhesive resin is bonded to functional group of chemically modified graphene.

KIM M G, HONG S M, OH J T, KIM J H, KIM J, OH J, HONG X, KIM M, MYEONGGI K