国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（4） H01（3） H05（3）
C08（2）
IPC小类 C09J（4） H01L（3） H05K（3）
C08K（2）
IPC C09J011/04（4）
发明人 ICHIKAWA I（3） ISAO I（3） TAKEO Y（3）
YOSHINOBU T（3）
公开年 2022（4）
申请年 2021（3） 
专利权人 LINTEC CORP（3）

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Hybrid adhesive composition useful for electromagnetic wave shielding, comprises conductive metal particles, graphene, adhesive resin and curing agent, where graphene is chemically modified graphene, and adhesive resin is bonded to functional group of chemically modified graphene.

KIM M G, HONG S M, OH J T, KIM J H, KIM J, OH J, HONG X, KIM M, MYEONGGI K