国家/地区 世界知识产权组织（5）
IPC部 C（5）
IPC大类 C09（5） C08（4） H01（2）
IPC小类 C09K（5）
IPC C09K005/14（5）
发明人
公开年 2022（4）
申请年 2022（5）
专利权人

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Preparing carbanogel buckypaper product as heat dispersing member, by receiving carbanogel by electrolytic process for splitting of carbon dioxide within molten electrolyte, where carbanogel comprises carbon nanomaterials and electrolyte, positioning in mold, and compressing carbanogel.

LICHT S, LICHT G

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Flexible cellular foam product used for article e.g. mattress, comprises flexible foam substrate, and coating layer comprising highly thermally-conductive nanomaterial, and binder which is at least one chosen from, e.g. acrylic polymer emulsions and styrene-butadiene latex.

STOJANOVIC H, SCHERREY A N, CRAWFORD M L