国家/地区 美国（4）
IPC部 C（4）
IPC大类 C10（4）
IPC小类 C23C（4） C10M（3） C01B（2）
F16C（2）
IPC C23C016/26（4）
发明人
公开年
申请年
专利权人

Acetylene fluid supply package for use in fabricating a semiconductor device, has pressure vessel, porous filler in the pressure vessel, improved solvent within the porous filler, where solvent solubilizing with acetylene absorbed within the improved solvent, improved solvent is triethyl phosphate.

HAN Y, CHUNG W, CHO Y, KANE W S, SONG X, SINHA A K, CHO Y J

Tribological system useful for e.g. rotor bearings in wind turbines, comprises base body and sandwich lubrication having binder-free solid lubricant layer including solid lubricant and lubricant layer with lubricant.

SCHWEIGKOFLER M, VENGUDUSAMY B, SEEMEYER S, LODERER D

Method for forming graphene on substrate used in mechanical system, involves forming solution processed graphene on substrate so as to establish low friction wear surface.

SUMANT A V, ERDEMIR A, CHOI J, BERMAN D

Applying graphene coating to a substrate containing iron or aluminum, comprises providing metallic layer on a surface of substrate, and contacting metallic layer with a source of carbon atoms to provide a graphene coating on metallic layer.

KINLOCH I, LEWIS A, KING M, LEVIS A