国家/地区 中国（29）
IPC部 C（29） B（14） H（11）
G（2）
IPC大类 C23（29） C01（11） H01（9）
B82（6） C22（5） B21（3）
B22（3） B05（2） C25（2）
G03（2） H05（2）
IPC小类 C23C（29） C01B（11） B82Y（6）
H01L（4） B22F（3） C22F（3）
H01B（3） H01M（3） B05D（2）
B21C（2） C22C（2） C25D（2）
G03F（2） H01G（2） H05K（2）
IPC C23C018/16（29）
发明人 XU J（3） CHEN H（2） CHENG X（2）
HUANG J（2） JIN P（2） LI X（2）
LI Y（2） LU Z（2） SHI Y（2）
TIAN S（2） WANG S（2） ZHANG H（2）
ZHANG M（2） ZHANG X（2） ZHANG Z（2）
公开年 2017（6） 2018（5） 2022（4） 2012（3） 2014（3） 2021（3） 2020（2）
申请年 2017（7）  2011（4）  2013（4）  2021（4）  2018（3）  2020（2）  2022（2） 
专利权人 SHENZHEN YUA.（2）

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Preparing surface metallization material comprises modifying surface of oxidation graphene the carbon nano-tube, mixing uniformly, mixing silver ammonia complex ion solution with modified silver oxide nano-powder coated with poly-dopamine layer on surface, and uniformly mixing.

WANG J

Nickel coated graphene used in e.g. electronics, comprises graphene, nickel salt, complexing agent, carboxy compound, reducing agent, stabilizer, and accelerant.

JU S

Silver nanoparticle/multilayer graphene composite material used e.g. in conductive adhesive ecomprises multi-layer graphene substrate and nano-silver particles uniformly distributed on the surface.

SONG K, WU J, HU X, WU F, XU D, SHI Y, GU C, XU J

Preparing graphene reinforced aluminum matrix composite material involves obtaining raw materials by drying graphene, aluminum powder and aluminum blocks in a drying box, and removing moisture, and chemically plating surface of the graphene with aluminum.

MA L, DING Y, YANG T, ZHAN S, JIA D, FAN Z, LI X, LI J, TU J, LI Y, DUAN H

Preparing wood composite material comprises e.g. taking pre-processed circular single plate hole, preparing activating liquid A, activating liquid B, activating liquid C, chemical plating copper liquid and chemical plating nickel liquid.

PAN Y, HUANG J, YIN D, GUO Q, ZHAO S, DAI M, WANG H, HU N

Method for photon induced material deposition, involves mixing first and second solutions to form reagent on substrate, and focusing light source on reagent to form mechanically rigid deposition in focus of light source.

YANG S, XIA K, HUNG S F, CHEN Y, HONG Z

Preparing gold-graphene composite coating on copper surface comprises e.g. adding graphene oxide dispersion into aqueous solution containing gold salt and complexing agent, mixing, adjusting pH value, cleaning and blow drying.

ZHANG J, ZHANG X, ZHANG B, GAO K

Performing electroless nickel plating on the surface of graphene involves removing the oil stains on the surface of graphene, and then putting into an hydrogen fluoride solution for ultrasonic treatment, and then washing and drying.

ZHANG H, GE Y, CAI H, CHENG X, LIU Y, FAN Q

Synthesis of electric wire involves adding methyl viologen, graphene oxide and silver nitrate to ethanol solution and then mixing, stirring mixture and then heating, pressing mixture and hot extruding.

WANG L