国家/地区 中国（3）
IPC部 C（4）
IPC大类 C25（4）
IPC小类 C25D（4） H05K（4）
IPC C25D009/04（4）
发明人 DU W（2）
公开年 2021（2） 2023（2）
申请年
专利权人 SHANGHAI DIB.（2）

Producing composite plated heat dissipation sheet using device, comprises e.g. injecting electromagnetic wave reflective material, and electromagnetic wave absorbing material into plating bath, and mounting heat radiation sheet.

LEE C S, YOO M J, YANG W S, SUHMOONSUHK, JEON Y, CHOIWONJUN

Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.

JING W, LI B, LI R, LI F, WU Q, PAN G

Device for printing circuit board by graphene, has conductive foil electrode line connected with metal foil sheet set in insulating plate assembly, and graphite sheet whose top end is connected with graphite sheet electrode line.

DU W

Device for manufacturing nano-circuit board, comprises insulating material barrel, where top surface of insulating material barrel is provided with transverse supporting one and transverse supporting two with longitudinal supporting one.

DU W, DU M