国家/地区 美国（5）
IPC部 F（5）
IPC大类 F28（5） B32（3） H01（3）
IPC小类 F28F（5） B32B（3） F28D（2）
H01L（2）
IPC F28F021/02（5）
发明人
公开年 2016（3）
申请年 2014（5）
专利权人

Composite foam used in electronics packaging industry, comprises metal template comprising sintered interconnects with dendritic particles, and conformal atomic-scale film comprising layer of graphene or hexagonal boron nitride.

CHAUHAN S S, NAGARKAR K R, MISNER M J, AHMAD F R

Composite structure comprises organic resin, carbon fiber and flat graphene nanosheets embedded in resin.

LUTZ M, TANZILLI D, BURGER N, LAACHACHI A

Graphene-based thermal management core for printed wiring boards (PWB) used for electronics applications, e.g., consumer electronics, has first or second reinforcement layer which includes substrate impregnated with non-dielectric resin.

SCHNEIDER D, DAVIS W E

System for extracting and distributing geothermal heat energy, has graphene-enriched product that is provided with graphene contacts heat source for conduction of heat.

BHARGAVA M

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X