国家/地区 中国（4） 美国（4）
IPC部 F（7） H（3） C（2）
IPC大类 F28（7） H05（3） C09（2）
IPC小类 F28F（7） F28D（4） H05K（3）
C09K（2）
IPC F28F021/02（7）
发明人
公开年 2018（7）
申请年 2017（7）
专利权人

Computing device comprises a set of components that includes a conductive sheet, which is provided with first graphene layer to dissipate a portion of heat, and second graphene layer that is used as an electrical ground.

MORRISON J T, FILES J W, NORTH T C

Graphene layer high heat-conducting radiator, has aging-resistant heat-conducting rubber layer directly fixed on outside of adhesive layer, and graphene heat-conducting interlayer directly fixed on outer surface of heat conduction pieces.

LIN R

Graphene rotational flow heat exchanger, has cyclone tube arranged within box body, rotational flow pipe rolled into spiral body by separating plate, and cover plate and side panel connected by expansion bolt.

SU C, QIU M, HAN H

Method for manufacturing heat spreader for printed wiring board, involves depositing layer of metal on layer of molybdenum and joining first and second graphene sheets to each other by alloy bonding first and second metal layers.

STARKOVICH J A, TICE J B, ZENG X, KOSTELEC A D, PENG H, SILVERMAN E M

Preparation of graphene thermally conductive film involves coating slurry prepared by dissolving graphene oxide powder in solvent, and defoaming resultant, on substrate, drying, winding, trimming, heating, cooling, and vacuum rolling.

ZHOU B, ZHOU R, LI F, LU J

Graphene-based substrate heat exchanger chip comprises heat-conducting chip monolithic frame forming complete heat exchanger unit by concave and convex pieces and heat exchanger units using plastic circular rod heat sealing.

ZHENG H

Thermally conductive composite material used in electronic device e.g. CPU, comprises unitary graphene matrix material which is single crystal or polycrystalline, and contains chemically bonded graphene molecules or merged graphene planes.

ZHAMU A, XIONG W, JANG B Z, LIN Y