国家/地区 中国（6）
IPC部 B（6）
IPC大类 C01（6）
IPC小类 C01B（6） B22F（5） C22C（4）
C22F（2） H01B（2）
IPC C01B032/184（6）
发明人 LI X（2）
公开年 2022（3） 2023（3）
申请年 2022（6）
专利权人

Preparing composite structure hydrophilic membrane electrode with composite structure comprises e.g. mixing lithium carbonate and titanium dioxide, calcining, modifying, mixing tannic acid modified active electrode material with solvent, coating on titanium plate, and drying.

DUAN X, ZHANG J, XIANG X

Preparing copper-graphene composite material involves utilizing mechanical alloying method to prepare copper and polymer powder to obtain copper-polymer powder, cold isostatic pressing copper polymer powder to get bar melting region to bar porous rod material.

LIANG J, ZHANG X, WANG D, LI X, ZHOU S, GUO G, BAO F

Preparing graphene composite copper heat-conducting film comprises adding graphene oxide into water, stirring to obtain graphene oxide slurry, adding copper sulfate solution, coating graphene oxide-copper sulfate composite slurry on substrate, heat-treating, sintering composite nano-copper film.

PAN Z, ZHOU M

Improving titanium-based composite material performance by oxygen-containing graphene modified dispersion comprises ultrasonically stirring and dispersing oxygen-containing graphene nanopowder in deionized water, placing reduced graphene oxide monomer solution and performing densification.

ZHANG Y, HUO W, LI L, ZHANG W, CHANG G, LI X, DONG L

Preparation of in-situ self-generated graphene/copper composite material with composite interface structure, used for e.g. large-scale integrated circuit lead, comprises heating raw material copper in air, soaking in formic acid, drying, and heating and carbonizing treatment.

ZHANG L, SHENG J, WANG L, FEI W

Graphene-enhanced copper-molybdenum composite material with three-dimensional network structure used in e.g. high voltage switch, microelectronic package and instrument field, comprises copper, molybdenum, and reduced graphene oxide.

XU R, FEI Y, LI Z, WANG X