国家/地区 美国（4）
IPC部 B（4）
IPC大类 B23（4）
IPC小类 B23K（4） C01B（4） B41M（2）
B82Y（2） C23C（2） H01L（2）
IPC C01B032/194（4）
发明人
公开年 2022（2）
申请年 2022（2） 
专利权人

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Manufacture of aerospace component involves treating surface of polymeric substrate with laser to form porous graphene at surface, and bonding metallic layer to porous graphene.

POTEET S, HUAPAYA R L N, BORDAGE K R, ROJAS HUAPAYA L N, ROJAS L N R

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N

Method for transferring graphene sheet from copper substrate to functional substrate, involves submerging functional substrate in floating bath, and decreasing fluid level of floating bath to lower graphene sheet onto substrate.

HEISE S E, BEDWORTH P V, SWETT J L, SINTON S W