国家/地区 韩国（3） 美国（2） 世界知识产权组织（2）
IPC部 B（4）
IPC大类 B82（4）
IPC小类 C08L（4） B82B（3） B82Y（3）
C01B（3） C08K（2） C09D（2）
IPC C08L063/00（4）
发明人
公开年 2013（2）
申请年 2012（4）
专利权人

Heat-dissipation composite is obtained by bonding carbon nanotubes with longitudinal direction of growth on nano-graphene plate, attaching carbon hybrid filler with carbon nanotubes, and mixing polymer resin with carbon hybrid filler.

HAN J H, LEE C S, PARK J S, SHIN K W, YU L

Making high-strength composite comprises e.g. plating conducting surface on substrate, electroplating flat graphene flakes onto surface from carrier fluid suspension of graphene flakes, removing plated substrate from vessel and drying.

BULLINGTON J A, STOLTZ R A, BULLINGTON J, STOLTZ R

Preparing functionalized graphene, comprises subjecting natural graphite to Friedel-Crafts reaction to obtain modified graphite, extracting, purifying and ultrasonically dispersing in an organic solvent to form a stable graphene suspension.

LIU K, LUO Y, LIU L, JIA D

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S