国家/地区 世界知识产权组织（5）
IPC部 B（5）
IPC大类 C01（5）
IPC小类 C01B（5）
IPC B32B007/12（3） B32B009/00（3） B32B037/12（3）
C01B032/182（3） C01B032/184（3） B32B015/04（2）
B82Y030/00（2） B82Y040/00（2） H05K003/46（2）
发明人 NAVEH D（3） ATIAS B（2） BENNAIM Y（2）
DANINO S（2） ELIYA Y（2） LEVI A（2）
LIPP E（2） MENTOVICH E（2） ROTEM Y（2）
公开年 2022（3） 2023（2）
申请年 2022（5）
专利权人 UNIV BARILAN（3） MELLANOX TEC.（2） PCB TECHNOLO.（2）

Manufacture of laminated graphene-based thermally conductive film used for electronic assembly, involves providing laminated film comprising graphene film layers separated by adhesive and comprising graphene sheets aligned with plane of graphene film.

LIU J, LAUBECK T

Production of solid carbon used in composition of matter, involves receiving carbon dioxide and water in reactor, dissociating carbon dioxide and water to form dissociated species, exposing dissociated species to electric field to facilitate reactions, generating and outputting solid carbon.

STOWELL M W, SIENKO L, STOWELL W M

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A