国家/地区 中国（3）
IPC部 B（4）
IPC大类 C22（4）
IPC小类 C22C（4）
IPC B22F001/054（2）
发明人
公开年 2023（4）
申请年 2022（4）
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Aluminum alloy materials for automotive structural parts, is using micro-arc oxidation surface treatment technology to prepare corrosion-resistant surfaces, and coating pretreated graphene-doped aluminum alloy substrate with carbon nanotube film, and treating surface by micro-arc oxidation.

ZHAO F, ZHU W, XU Y, WANG Z, LI M, CHENG K, YANG G, XIN W, LV T, JIAO P, GAO S, WU S, ZHAO X, CUI L

Preparing binary metal alloy catalyst used in catalysis of electrolytic water hydrogen evolution reaction in alkaline environment involves dispersing conductive carrier in water, dissolving noble metal and non-noble metal precursors, adding mixed solutions, centrifuging, washing, drying and heating.

TANG R, ZHOU Q, WU D, ZHU Y, LIAO X, ZENG L

Preparing high-strength aluminum alloy plate for sheet metal process, comprises e.g. taking ZL114A as aluminum alloy plate base material, adding modifier, heating, adding refining agent, polishing, placing aluminum alloy plate in electrolyte for anodic oxidation, sealing, and drying.

XU J