国家/地区 世界知识产权组织（2）
IPC部 B（3）
IPC大类 B82（3） C01（2） C23（2）
G01（2） G06（2）
IPC小类 B82Y（3） C01B（2） C23C（2）
IPC B82Y010/00（3）
发明人
公开年 2022（2）
申请年 2022（3）
专利权人

Assembly used as superconducting diode assembly, has structure comprising layer of material positioned in contact with layer of another material to form interface between material and another material, and control apparatus to control ferromagnetic state associated with interface.

LI J, SCHEURER M S, LIN J, SIRIVIBOON P, MORISSETTE E

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Preparing surface plasmon resonance biological sensing chip useful in field of surface plasmon resonance for analyzing biomolecule interaction, comprises e.g. covering noble metal layer on surface of substrate, and depositing graphene nano-layer and nano-diamond particle layer.

CHEN L, LIU G, ZHENG C, XIAO L, LUO Y, CHEN Y