国家/地区 中国（2） 欧洲专利局（EPO）（2） 韩国（2） 美国（2） 世界知识产权组织（2）
IPC部 B（3）
IPC大类 B22（3）
IPC小类 B22F（3）
IPC C01B032/182（3）
发明人
公开年
申请年
专利权人

Composite used for forming thermal management component such as bearing, heat sink, base plate and cooling fin for cooling high power electronic component, comprises particles of metal or metal alloy in which at least one of particles are coated with at least one particles of graphene.

MANNINEN J, SILVENNOINEN M, PAKARINEN J

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Making graphene-reinforced inorganic matrix composite, comprises e.g. mixing multiple particles of graphitic material and solid inorganic material, and operating apparatus for transferring graphene sheets to material particles surfaces.

ZHAMU A, JANG B Z