国家/地区 中国（5）
IPC部 C（5）
IPC大类 C23（5） C01（2） C09（2）
C22（2） C25（2）
IPC小类 C23C（5） C01B（2） C09K（2）
C22C（2） C25D（2）
IPC C23C018/40（5）
发明人
公开年 2021（3） 2022（2）
申请年 2021（5）
专利权人

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Preparing surface metal layer used in aerospace, electrical and electronic fields, involves e.g. coarsening, sensitizing and activating polyetheretherketone modified with carbon fiber, glass fiber, carbon nanotube and graphene, chemical plating and electroplating copper, and plating nickel.

ZHANG L, TONG X, WANG J, ZHANG J, WEN C, LI S, CUI Q, WANG X, XU J, FENG L, BAI J, LI J, WANG N

Preparation of graphene oxide/ titanium carbon nitride-doped tungsten copper composite material involves weighing copper powder, tungsten powder, and graphene oxide powder, putting powders in sealed tank, filling composite powder into graphite mold and placing in vacuum sintering furnace.

CHEN W, LI W, LI X, HUANG Y

Copper/graphene composite film material prepared by adding single-layer graphene dispersion to basic electroless copper plating solution by using ultrasonic-assisted electroless plating method to co-deposit metallic copper and single-layer graphene on surface of substrate.

SHU X, CUI J, WANG Y, QIN Y, TAO X, ZHOU Z, WU Y, ZUO Y, ZHANG Y

Preparing high-strength magnesium-based three-dimensional graphene composite material comprises e.g. performing chemical plating method and hydrothermal chemical reaction method, melting copper-three-dimensional grapheme and deforming.

YU Y, XIAO Z, YAN Z