国家/地区 美国（5）
IPC部 B（5）
IPC大类 C22（5）
IPC小类 C22C（5）
IPC B22F003/24（3） B22F009/04（2） B23Q003/15（2）
C22C038/10（2） C23C004/11（2） C23C004/134（2）
C23C016/26（2） H01L021/683（2） H01L021/687（2）
H02N013/00（2）
发明人 HANSANG K（2） KWON H（2）
公开年 2022（4）
申请年 2022（5）
专利权人 UNIV PUKYONG.（2）

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Conductor material, has metal matrix, first carbon allotrope distributed within metal matrix, where first carbon allotrope is aligned with direction of electric current flow through length of metal matrix, and metal matrix and first carbon allotrope have electrical interfacial coherency.

KRAFT F F

Metal-graphene composite comprises metal layer and graphene layer provided by growing directly on one surface of metal layer, where graphene layer contains two and/or more graphene thin, metal layer is copper, nickel, cobalt, iron, manganese, chromium, vanadium, titanium, platinum, gold and aluminum.

KIM D J, HONG B H, WOO Y S, KIM D, YU Y S

Manufacturing electrostatic chuck having high heat dissipation property, high resistance to thermal shock and lightness, involves preparing composite powder by ball-milling aluminum or aluminum alloy powder and carbon-based nanomaterial powder, preparing electrode layer and forming dielectric layer.

KWON H, HANSANG K

Manufacturing electrostatic chuck having high heat dissipation property, involves preparing composite powder by ball-milling aluminum or aluminum alloy powder and carbon-based material powder, manufacturing multilayer billet, extruding and forming dielectric layer.

KWON H, HANSANG K