国家/地区 中国（4）
IPC部 B（4）
IPC大类 B21（4）
IPC小类 B21B（4）
IPC B21B003/00（3） B21B001/38（2） C22C009/00（2）
C23C016/26（2） C23C016/56（2） C23C028/00（2）
发明人
公开年 2022（4）
申请年 2021（2）  2022（2） 
专利权人

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Preparing graphene metal layered composite material useful in aerospace industry, aviation industry and information industry, comprises pre-treating solid carbon source, growing graphene on many metal substrates and hot-pressing many graphene metal substrates.

SHAO L, LI X, ZHANG Y, LI Z, HUANG D, SHI H, DUAN Y

Continuous preparation method of three-dimensional in situ graphene reinforced metal base composite material used in aerospace and automobile , involves conveying stacked multi-layer graphene foam metal strip.

SHI P, SHEN Z, LIN Z, ZHONG Y

Preparation method of metal magnesium-copper-graphene layered composite material, involves annealing accumulated and rolled plate to obtain laminated magnesium-based composite plate reinforced by graphene and copper.

PAN F, WANG Y, LUO H, TANG B, LI J, CHEN X