国家/地区 美国（3）
IPC部 C（3）
IPC大类 F28（3）
IPC小类 F28F（3） C01B（2）
IPC C01B031/04（2）
发明人
公开年 2013（3）
申请年 2013（2） 
专利权人

Insulated thermal interface material for applying between electronic element e.g. central processing unit, and thermal dissipating element, comprises base including polymer, and filler including graphene dispersed in base.

LING Y, WANG C, LIU J, LING Y C, WANG C P, LIU J Y

Dispersion of carbon nanotubes or graphene using external energy source for mixing, utilizing hemicellulose that contains e.g. glucose and xylose in backbone as dispersion agent, used to fabricate e.g. electromagnetic interference shield.

KANGAS V, MOILANEN P, VIRTANEN J

Graphene-based heat dissipation system for e.g. portable microelectronic device, has heat-conducting layer comprising sheet of integrated graphene film, which shields component or external surface of electronic device from heat.

ZHAMU A, WANG M, XIONG W, JANG B Z