国家/地区 中国（4）
IPC部 B（4）
IPC大类 B21（4）
IPC小类 B21B（4）
IPC B21B001/22（2） B21B003/00（2） C21D009/00（2）
C23C028/00（2）
发明人
公开年 2022（2） 2023（2）
申请年 2022（4）
专利权人

Coated aluminum-silicon plated steel plate useful in thermoformed component, comprises steel substrate and aluminum-silicon coating coated on the surface of the steel substrate, where the surface of the aluminum-silicon coating is covered with coating.

MA X, JIN X, LIU H, TAN N

Processing and forming liquid cooling plate involves using high heat-conducting coefficient of aluminum alloy profile, sequentially acid eluting grease, coating anti-composite material graphene heat treatment, rolling composite, and blowing.

SHI C, YANG R, ZAN Y, SHI X, RUAN R, YOU H, ZHUO N, WU Y

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Preparing graphene metal layered composite material useful in aerospace industry, aviation industry and information industry, comprises pre-treating solid carbon source, growing graphene on many metal substrates and hot-pressing many graphene metal substrates.

SHAO L, LI X, ZHANG Y, LI Z, HUANG D, SHI H, DUAN Y