国家/地区 韩国（5）
IPC部 B（5）
IPC大类 B82（5）
IPC小类 B82B（5）
IPC B82B003/00（5） C01B031/02（4） B82Y030/00（3）
C08L063/00（3） C08K003/04（2）
发明人
公开年 2013（3）
申请年 2012（5）
专利权人

Heat-dissipation composite is obtained by bonding carbon nanotubes with longitudinal direction of growth on nano-graphene plate, attaching carbon hybrid filler with carbon nanotubes, and mixing polymer resin with carbon hybrid filler.

HAN J H, LEE C S, PARK J S, SHIN K W, YU L

Composite comprises polyimide, graphene, carbon nanotubes, and silicon carbide.

TAE O W, HAN K D

Making high-strength composite comprises e.g. plating conducting surface on substrate, electroplating flat graphene flakes onto surface from carrier fluid suspension of graphene flakes, removing plated substrate from vessel and drying.

BULLINGTON J A, STOLTZ R A, BULLINGTON J, STOLTZ R

Preparation of functionalized graphene nanoribbons used for e.g. deicing circuit, involves exposing carbon nanotubes to alkali metal source in presence of aprotic solvent and exposing opened carbon nanotubes to electrophile.

TOUR J M, LU W, GENORIO B, TOUR J, TOUR YA M, LU V

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S