国家/地区 日本（4）
IPC部 C（4）
IPC大类 C04（4）
IPC小类 C04B（4）
IPC C01B032/194（2） C01B032/21（2） C04B037/02（2）
H01L023/36（2） H01L023/373（2）
发明人
公开年 2021（3）
申请年 2021（4）
专利权人 MITSUBISHI M.（2）

Ceramic structure for forming component of plasma processing apparatus, contains silicon carbide, silicon carbonitride, titanium carbide or titanium carbonitride as main component, and two main surfaces having different carbon concentration.

HAMASHIMA H

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N

Silicon-silicon composite oxide-carbon composite used for negative electrode active material for lithium secondary battery, comprises core-shell structure comprising core comprising silicon, silicon oxide compound, and magnesium silicate, and shell comprising carbon layer, and has preset span value.

LEE E, PARK H, LIM S W, OH S M, LIM J C, HUNSOO P, IMSUNGWOO, LIM J