国家/地区 美国（4）
IPC部 C（4）
IPC大类 C08（4） C09（2）
IPC小类 C08K（4）
IPC C08K005/00（4）
发明人 ALKA A（2） ALKAN A（2） ALKANE A（2）
BAYER A（2） CADALBERT A（2） DALBERT A（2）
HOFFMANN B（2）
公开年 2022（4）
申请年 2020（3） 
专利权人 EMSCHEM AG（2）

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Polyamide molding composition used as a filled polyamide molding for producing moldings or components of automotive sector, comprises partially crystalline and aromatic polyamide, functionalized impact modifier, metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKANE A, DALBERT A, ALKA A

Polyamide molding compound used for forming e.g. component of engine compartment of automotive application, comprises partially crystalline, partially aromatic polyamide and/or caprolactam-containing polyamide, filler, optionally substituted metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKA A, ALKANE A, DALBERT A

Multilayered flexible package useful in packaging systems for food, cosmetic, nutraceutical or pharmaceutical products, comprises polymeric coating comprising dispersion of antioxidant particles.

RIVA M, VACCA P, FIDECKA K, FIDECA C