国家/地区 韩国（7）
IPC部 C（7）
IPC大类 C09（7） B32（4） H01（3）
C08（2）
IPC小类 C09D（7）
IPC C09J011/04（7）
发明人 PARK Y S（2）
公开年 2022（3） 2021（2）
申请年 2020（3）  2021（2） 
专利权人

Gel nail sticker comprises adhesive layer containing adhesive component and graphene having preset size, printed layer including pattern and transparent coating layer containing ultraviolet-curable resin.

KOH S W

Vehicle window film useful for blocking sunlight in UV and IR regions without interfering with radio waves of electronic device i.e. smart phones, comprises e.g. adhesive layer, first polyethylene terephthalate layer, and hard coating layer.

LEE C S, OH I H

Resin composition used for forming adhesive film for forming dicing die-bonding film, comprises polymer substrate comprising curing agent and (meth)acrylate-based resin, and magnetic filler comprising core and coating layer containing yttrium oxide and ferrite.

JANG J M, JU L K, SUN Y, SUN Y L, LEE K J

Heat dissipation composition used for forming coating agent, comprises base polymer containing silicone-based resin and filler containing at least two of expanded graphite, carbon nanotubes, graphene and metal nanoparticles.

HWANG I S, PARK Y S, HWANG I C, PARK K H, HWANGINSEONG, CHAN H, PARK K

Secondary battery pouch film comprises sealant layer, adhesive layer formed on sealant layer, primer layer formed on adhesive layer, core layer formed on primer layer and surface layer, where at least one above-mentioned layer has graphene.

HEO C H, PARK Y S, KANG T W, HEO C, PARK Y, KANG T, HEO J H, SOON P Y, KANGTAEWOON

Conductive heat-radiation material composite used for forming heat-radiation product, comprises carbon material particles comprising graphene nanoparticles, graphite nanoparticles and carbon nanotubes, with metal ion bonded on surface.

KIM K, OH C W

Manufacture of electromagnetic-wave-absorption film for e.g. personal computer, involves coating organic-solvent dispersion liquid comprising graphene microparticles and binder resin on surface of plastic film, and drying coated film.

KAGAWA S, SEIJI K