国家/地区 美国（3）
IPC部 C（3）
IPC大类 C09（3） H01（3） H05（2）
IPC小类 C09D（3）
IPC H01L023/00（3）
发明人
公开年 2022（2）
申请年
专利权人

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Resin composition used for forming adhesive film for forming dicing die-bonding film, comprises polymer substrate comprising curing agent and (meth)acrylate-based resin, and magnetic filler comprising core and coating layer containing yttrium oxide and ferrite.

JANG J M, JU L K, SUN Y, SUN Y L, LEE K J

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S