国家/地区 中国（8）
IPC部 C（8）
IPC大类 C09（8）
IPC小类 C09D（8）
IPC C09D007/61（4） C09D007/63（4） C09D005/08（3）
C09D163/00（2） C09D163/02（2）
发明人 ZHANG S（8）
公开年 2023（8）
申请年 2021（4）  2022（3） 
专利权人 CHINA PETROL.（4） CHINA PETROL.（4）

Graphene water-based wave-absorbing coating structure comprises base layer, where front surface of base layer is provided with first function layer comprising cooling glue heat insulation coating and polyimide coating layer.

DONG H, ZHANG S, LI B

Graphene-containing heavy-duty anticorrosive coating useful for crude oil storage tanks, ships, offshore platforms, and offshore wind power installations, comprises graphene, epoxy resin, hydroxy triazine, glycidyl ether silane, first solvent, filler, second solvent, curing agent and aminophenol.

DENG J, ZHANG S, DONG W, SUN S

Graphene epoxy coating useful in crude oil storage tank, ship, offshore platform and offshore wind power device comprises graphene, epoxy resin, hydroxytriazine, glycidyl ether silane and curing agent.

DENG J, ZHANG S, DONG W, SUN S

Graphene-containing epoxy zinc powder coating useful in steel structure, ship, offshore platform and offshore wind power device, comprises first component (comprised of zinc powder, graphene and epoxy resin) and second component (comprised of curing component).

DENG J, ZHANG S, DONG W, SUN S

Heavy anti-corrosive coating useful in steel structure, ship, offshore platform and offshore wind power device, comprises graphene, epoxy resin, and curing component.

DENG J, ZHANG S, DONG W, SUN S

Water-blocking material for sealing openings of heat-insulating materials used for preparing structure, comprises components polysiloxane, polyether polyol isocyanate, polyolefin polyol, curing agent, catalyst, defoamer, and filler.

HU B, LIU Y, HE W, NI X, PAN Z, ZHANG S, WANG T

Manufacturing flexible circuit board with electric heating patch comprises e.g. taking flexible single-sided copper clad laminate, manufacturing circuit pattern, manufacturing first solder resist ink composite graphene resin layer on positive-negative combination circuit, pre-baking, and cutting.

LEI H, ZHANG S, GE W, OU D, WU T, QIN J, PENG G, WANG W, WANG M

Conductive micropowder useful for polymer-based positive temperature coefficient (PTC) materials, comprises crystalline organic layer coated on surface of solid filler for polymer-based PTC materials, where solid filler for polymer-based PTC material includes conductive carbon material.

WEN Y, ZHANG S, CHEN R, LIN B, REN K, WANG Y, CHENG W, HAN L, ZHANG Z, WANG M