国家/地区 中国（3）
IPC部 C（3）
IPC大类 C23（3） C25（3）
IPC小类 C23C（3）
IPC C23C016/26（3）
发明人 ZHANG Z（3）
公开年 2020（2）
申请年 2019（2） 
专利权人 CHINA DONGFA.（2）

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E

Preparing low-temperature hydrophobic heat exchange material based on stainless steel and graphene comprises e. g. plating copper or nickel on surface of stainless steel and performing chemical plating or electroplating.

ZHANG Z, YANG D, HE P

Preparing stainless steel composite material for condensation heat exchange, involves plating copper or nickel on the surface of stainless steel, using electroless plating or electroplating, preparing graphene hydrophobic coating.

ZHANG Z, YANG D, HE P