国家/地区 中国（4） 美国（2）
IPC部 C（5）
IPC大类 C23（5） C25（5） H01（3）
IPC小类 C23C（5）
IPC C23C028/00（5）
发明人 GUO C（2） LAI H（2）
公开年 2021（3）
申请年 2020（5）
专利权人 GUANGZHOU UL.（2）

Dull nickel-plated and graphene-enclosed plating structure for zinc alloy die-casting parts, has zinc-nickel alloy plating layer that is prepared from inside to outside sequentially zinc alloy base portion.

LAI H, CHEN K, GUO C

Doping method involves stacking sacrificial layer on doped layer, arranging doping material on the sacrificial layer, arranging electrodes on doping material and doped layer, and doping doping material into doped layer.

SON K, KIM T, SON A

Protective layer structure of non-cyanide cadmium plating and electrophoretic painting comprises metal substrate, non-cyanide cadmium plating layer, phosphate layer and electrophoretic paint coating comprising hydroxyl graphene material.

GUO C, PENG C, LAI H

Connector e.g. male connector, comprises electrical contact material containing metal base material and conductive coating layer containing phase made of metal other than gold, and phase made of gold or non-metallic conductive material.

KUBO T, OKADA M, SHIMIZU T, KAWAI H, KAWAI Y

Flexible complex film comprises nano porous gold film layer, polypyrrole layer, nano gold particle embedded in polypyrrole layer and graphene layer, prepared e.g. by preparing nano porous gold film by removing alloying free corrosion method.

HOU Y, ZHANG H, YANG Y, ZHANG J, GUO J