国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5） C23（2）
IPC小类 C25D（5）
IPC C25D005/00（5）
发明人
公开年 2022（4）
申请年 2022（5）
专利权人

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Electroplating plastic surface useful for door guard plate of automobile comprises mixing graphene, silicon dioxide sol, epoxy resin, curing agent and water, removing oil, spraying mixed slurry, carrying out chemical plating and electroplating, washing, and drying.

LI J, SUN L

Preparing nickel-graphene super-hydrophobic coating, comprises using metal substrate as cathode and nickel as anode, electroplating in plating solution, vacuum drying, obtaining nickel-graphene super-hydrophobic coating on surface of metal substrate.

YANG C, LI Z, WANG A, XING X, ZHANG R, LIU J, CUI G

Hardening stainless steel surface, involves taking sleeve base body after ultrasonic rolling, carburizing surface to form carburized layer, taking sleeve base body after carburization, and brightening surface to obtain finished product sleeve.

BIAN C

Surface treatment for reducing secondary electron yield of oxygen-free copper for e.g. radar, by performing ultrasonic cleaning on oxygen-free copper sheet, performing surface electrolysis treatment in copper sulfate solution, performing electrochemical deposition, and performing heat treatment.

GE Y, FU H, DU Y, PAN P, CAI J, ZHANG H, HAO J