国家/地区 美国（3） 中国（2） 欧洲专利局（EPO）（2） 世界知识产权组织（2）
IPC部 C（5）
IPC大类 C23（5）
IPC小类 C23C（5）
IPC C23C018/20（5）
发明人 BAE A H（2） HWANG T S（2） LEE J H（2）
NAM J D（2） OH J S（2） SON S I（2）
公开年
申请年 2011（2） 
专利权人 SAMSUNG ELEC.（2）

Electroplating plastic surface useful for door guard plate of automobile comprises mixing graphene, silicon dioxide sol, epoxy resin, curing agent and water, removing oil, spraying mixed slurry, carrying out chemical plating and electroplating, washing, and drying.

LI J, SUN L

Enhancing surface adhesion of polyetherimide for metal plating involves contacting sulfuric acid with polyetherimide substrate surface to form pre-etched substrate, and contacting substrate with sulfuric acid and periodate ions mixture.

NARUSKEVICIUS L, HYMAN M

Surface-metalized polymer article comprises polymer component, first layer composed of multiple graphene sheets and conducive filler coated on polymer component surface, and second layer of plated metal deposited on first layer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z, LI S

Resin plating method during manufacture of e.g. electronic equipment, involves forming graphene thin layer on resin substrate by applying expanded graphite dispersion to resin substrate and electroplating resin substrate.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S

Resin plating comprises forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on it.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S, LEE H, EAH H B, SANG I S, JAE D N, JOON S O, JUN H L, TAE S H, HWANG T, LEE J, NAN J, PAE A, SUN S, OU J