国家/地区 美国（3）
IPC部 C（3）
IPC大类 C25（3） H05（3）
IPC小类 C25D（3）
IPC H05K003/42（3）
发明人 YANG N（2） YEH A（2）
公开年
申请年
专利权人 TRIALLIAN CO.（2） YEH A（2）

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Conductive slurry for plating circuit board, comprises carbon material containing carbon nanotube and/or graphene, dispersant and binder, which are uniformly mixed in solvent.

CHIU C, HUANG C

Method for modifying walls and bottoms of holes with reduced graphene oxide, involves providing substrate with copper cladding layer and drilled holes, while modifying walls and bottoms of holes with reduced graphene oxide.

YEH A, YANG N, YEH D, YANG F