国家/地区 中国（3）
IPC部 B（4）
IPC大类 C23（4）
IPC小类 C23C（4）
IPC C25D007/00（4）
发明人
公开年 2022（2） 2023（2）
申请年 2022（4）
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z

Conductive pre-coating useful for e.g. fuel cell titanium plate, comprises first metal particle layer distributed on surface of titanium substrate, in-situ oxidation layer covering surface of first metal particle layer, and second metal layer covering surface of in-situ oxidation layer.

LAN S, HU P, JIANG T, BI F, LI H

Multifunctional composite coating of steel structure surface comprises multi-element permeation substrate (zinc powder and aluminum powder), graphene anti-corrosion film (powdered graphene oxide and pyrrole) and fireproof outer layer (flame retardant) provided from inside to outside.

ZHANG H