国家/地区 中国（2） 美国（2） 世界知识产权组织（2）
IPC部 C（3）
IPC大类 C23（3）
IPC小类 C23C（3）
IPC C23C016/02（3）
发明人
公开年 2021（3）
申请年 2020（2） 
专利权人

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E

Composition useful as catalysts and electrodes, comprises a nanoporous carbon powder comprising nanopores having disposed in it copper metal nanostructures and an elemental copper nanowires.

NAGEL C J, BRODEUR C L, NAZEL C A J, BRODARD C L

Enhancing surface adhesion of polyetherimide for metal plating involves contacting sulfuric acid with polyetherimide substrate surface to form pre-etched substrate, and contacting substrate with sulfuric acid and periodate ions mixture.

NARUSKEVICIUS L, HYMAN M