国家/地区 美国（7）
IPC部 C（7）
IPC大类 C25（7） C01（5） H01（4）
B05（2） B82（2） C23（2）
IPC小类 C25D（7）
IPC C01B031/04（4） C01B031/02（3） B05D005/12（2）
B82Y040/00（2） C25B001/00（2） C25D003/38（2）
C25D005/48（2）
发明人
公开年 2014（4） 2015（2）
申请年 2013（7）
专利权人

Producing graphene layer from liquid metal matrix on solid metal or ceramic substrate of multilayered plate containing e.g. graphene forming matrix, comprises heating, annealing and supplying acetylene, ethylene and hydrogen and cooling.

MODRZYK W, KULA P, RZEPKOWSKI A, PIETRASIK R, ATRASZKIEWICZ R, DYBOWSKI K

Fabricating method of supercapacitor, involves providing electrically conductive substrate, and layer of chemically reduced graphene oxide contiguous to second substrate surface to provide electrical double layer associated with substrate.

CHEN B, MEYYAPPAN M

Graphene film used in an electrode is obtainable by epitaxially growing metal layer on surface of substrate, peeling off the metal layer, and depositing graphene onto surface of metal layer.

WODTKE A, YU H K, ALEC W, HAK KI Y, YU H, YUK H K, YUK H

Preparation method of graphite oxide and/or graphene used as nanomaterial in field of e.g. optoelectronics, energy, chemical material involves using graphite electrode as cathode of plasma electrolytic apparatus.

WEI K, DANG V T, WEI K H

Synthesizing anode material used for rechargeable battery used for e.g. laptop, comprises inserting working and counter electrodes in colloidal suspension of graphene oxide, forming film on working electrode, and drying film to form paper.

MUKHERJEE R, THOMAS A V, KORATKAR N, SINGH E

Apparatus for manufacturing device used for preparing graphene for electronic circuit, comprises graphene structure including metal catalyst layer formed on substrate, protection layer, and graphene layer, and power unit.

LEE J, JUNG Y, KIM Y, LEE C, MOON C, LEE J H, JUNG Y S, KIM Y S, LEE C S, MOON C Y, MUN Z R

Method for manufacturing electrical conductor, involves depositing boundary cappings on defects of graphene layer to inhibit corrosion of the substrate layer at defects and depositing boundary capping material on substrate layer.

LIU Z, ZHENG M, MARTENS R I, MARTENS R