国家/地区 中国（7）
IPC部 C（7）
IPC大类 C09（7）
IPC小类 C09D（7）
IPC C09D011/102（7）
发明人
公开年 2022（3）
申请年 2022（3） 
专利权人

Conductive ink composition useful in transparent conductive film, comprises 2,4-toluene diisocyanate, polyethylene glycol, epoxy resin, conductive carbon black, conductive graphite, curing agent, solvent, and dispersant, where epoxy resin is bisphenol-A-type epoxy resin epoxy resin.

WANG D

Conductive ink resin composition useful for forming transparent conductive film comprises aqueous resin composition containing poly(3,4-ethylenedioxythiophene) polystyrene sulfonate, co-solvent, nano-conductive auxiliary additives, ductility aid, and solvent.

YOU Z

Insulating ink useful e.g. for packaging semiconductor passive element and voltage division comprises e.g. polyurethane resin, phenolic resin, epoxy resin, additives, solvent, carbon material composite, carbon material composite, and zero-dimensional fullerene carbon material.

ZHAO J, XIANG W, ZHANG B, ZHANG Y, HUANG S, GAO J

Manufacturing method of transparent flexible film electrode, by coating surface of the substrate with polyimide, obtaining heat-conductive protective layer, coating UV curing liquid on surface of coating polyimide after obtaining electrode pattern and curing to obtain transparent packaging layer.

PENG L, ZHAN S, ZENG X, JIN S

Self-limiting temperature graphene heating membrane assembly for power batteries, comprises a battery pack and a heating membrane assembly for heating the battery pack, where the heating mold assembly includes a heating film.

HUANG J, YU D, HE P, LIU Q, XIE X

Film used for graphene heat-generating assembly used as heat source for power battery pack, comprises organic polymer base film and heating circuit formed on base film by applying graphene conductive paste on base film surface, and curing.

LIU B, WANG T, HUANG X, DU Y, WU F, LUO P

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A