国家/地区 中国（9）
IPC部 C（9）
IPC大类 C09（9）
IPC小类 C09D（9）
IPC C09D179/08（9）
发明人
公开年 2021（4） 2022（2）
申请年 2020（3）  2021（3） 
专利权人

Black non-adhesive flexible copper-clad plate used in flexible printed circuit board, comprises copper foil sequentially, first polyimide layer comprising black filler, and second and third polyimides.

WU H, RU J, LUO H, LIANG L

Flexible heating film comprises conductive structure comprising carbon nanotubes and/or graphene, and polyimide backbone that is chemically linked to aminated conductive structure via anhydride bonds.

ZHENG T, ZHANG M, ZHANG Y, MAO O, ZUO B

High temperature graphene conductive coating composition comprises conductive powder, graphene, resin, coupling agent and dispersant.

LI H, LI Q, TAO Y, SUN J, SONG Y

High temperature composite aluminum base heater comprises resistance coating, conductor coating, aluminum alloy substrate, inner insulating coating and outer insulation coating.

CHENG Y, LI Y, HE J, ZHU F, LI L

Preparing graphene electric heating film containing in-situ polymerized insulating coating comprises e.g. placing graphene aqueous dispersion in suction filter device containing polytetrafluoroethylene filter membrane, and filtering.

LIU H, QIAN T, MA D

High-safety composite electric heating film comprises electric heating layer arranged between upper electrode layer and lower electrode layer, and insulating and heat-conducting discoloring body attached to lower electrode layer.

XIA Y, CAI P, ZHANG W, HUANG H, GAN Y, LIANG C, ZHANG J, HE X

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Preparation of graphene modified polyimide composite film used in flexible circuit board, involves coating graphene-modified polyimide composite layer on surface of polyimide film.

MIN Y, WENG L, LIU Y, QI F, HE T

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN