国家/地区 中国（4）
IPC部 D（4）
IPC大类 D01（4）
IPC小类 D01D（4）
IPC D04H001/728（4）
发明人
公开年 2023（4）
申请年 2022（2）  2023（2） 
专利权人 UNIV BEIJING.（2）

Preparing polymer-based heat conductive complex material with a sandwich structure comprises alternately arranging a heat-conducting filler layer and a polymer layer, and hot-pressing.

ZHOU J, LIU Y

Photothermal material useful in seawater desalination, comprises polyacrylonitrile-cobalt-manganese layered double hydroxide film with a hierarchical structure.

ZHAO W, CHEN W, ZHENG R, SONG Y

Preparing high-strength aluminum alloy material for 3C electronics comprises e.g. adding aluminum chloride hexahydrate and aluminum nitrate nonahydrate to nitric acid solution, stirring, reacting with aluminum isopropoxide, electrospinning, hot-pressing, soaking in graphene solution and calcining.

XU Y, LI M, SU H, HAN L, XU Q, YANG G, ZHAO J, CHENG K, XIN W, LV T, GAO S, WU S, ZHAO X, CUI L

Graphene filter film comprises first non-woven fabric layer, graphene layer and second non-woven fabric layer arranged in sequentially, where each layer is embedded with each other at connection position.

JU Y, YI J, WANG W, WANG D