国家/地区 韩国（4）
IPC部 B（4）
IPC大类 B32（4） F28（4） C09（3）
H01（3） H05（3） C01（2）
IPC小类 B32B（4）
IPC F28F021/02（4）
发明人
公开年 2014（3）
申请年 2013（2） 
专利权人

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Method for manufacturing radiant heat sheet of heat dissipation device, involves forming composite dispersed solution in inner side of adhesive part, where heat dissipation films are made of graphene and carbon nanotube.

PARK Y S, PARK Y

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K