国家/地区 中国（3） 台湾（2）
IPC部 F（5）
IPC大类 F28（5） H01（4） G06（3）
H05（2）
IPC小类 F28D（5）
IPC F28D015/02（5）
发明人 ZHENG Z（2） ZHONG M（2）
公开年 2022（5）
申请年 2022（3） 
专利权人 LAUREL ELECT.（2）

Uniform temperature device, has base plate comprising first surface and second surface opposite to first surface, heat conducting piece arranged on first surface of substrate, and radiation layer arranged on second surface.

ZHONG M, ZHENG Z

Uniform temperature device i.e. stacked uniform temperature equalizing device, has set of heat conducting pieces arranged on first surface of base plate, and radiation layer arranged on second surface of plate.

ZHONG M, ZHENG Z

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Temperature equalizing device for enabling heat source to achieve uniform heat dissipation, has radiation layer that is arranged on second surface of substrate.

CHENG C, CHUNG M H

Thermal management device for electronic device, has bracket that is provided with clamping portion that holds heat pipe by side exterior surfaces of heat pipe, and that does not extend past first exterior surface of pipe.

HUANG H, WU K, CHANG C H