国家/地区 世界知识产权组织（8）
IPC部 C（8）
IPC大类 C09（8）
IPC小类 C08K（5） C09K（5） C09D（3）
F02C（3） B32B（2） F01N（2）
F28F（2） H05K（2）
IPC C08K003/04（5） C09D007/61（3） C09K005/14（3）
C08K007/06（2） F02C007/24（2） F28F013/00（2）
H05K007/20（2）
发明人 LI Z（2） PICCALUGA P（2） STEFFAN C（2）
公开年 2021（8）
申请年 2020（8）
专利权人 FLEBUS O（2） PICCALUGA P（2） STEFFAN C（2）

Demagnetizing and electromagnetic magnetic depolarizing information effect of electric and magnetic fields of air by presence of deployed metal grid inserted in air circulation by switching depolarized fields of structure in exchange on air.

JOSE B, PICCALUGA P, STEFFAN C

Method for correcting Brownian effect of particles in quantum entanglement, involves moving circulation of ordered particles by quantum electrodynamics on axis oriented by electric/magnetic fields of pigments.

BUENDIA J, PICCALUGA P, STEFFAN C, PERRICHON C, MARTY F, FLEBUS O, CHARBONNEAUX M

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

System used for energy storage, consists of fluidized bed apparatus with energy storage material comprising volume having largest size in preset interval, and coated with outer layer of solid particles having largest size in preset interval.

CROON L, BLACKMAN C

Flexible heat transfer material for thermally contacting one cell within a battery pack, comprises a matrix and a filler and the thermal conductivity of the filler is greater than the thermal conductivity of the matrix.

FLANNERY B

System used to cool object or space comprises refrigeration process loop, dehydration process loop and distillation membrane module with feed chamber and permeate chamber.

BERGIDA J R, LEAVITT D D, VANNESTE J, BUSH J A, LEAVITT D

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y