国家/地区 美国（4）
IPC部 F（4）
IPC大类 F28（4）
IPC小类 G06F（3） H05K（3） F28D（2）
F28F（2） H01L（2）
IPC G06F001/20（3） H05K007/20（3）
发明人
公开年 2021（4）
申请年 2020（2） 
专利权人

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C

Thermal energy-transfer system such as grade beam, comprises thermally conductive concrete comprising carbon, metals and/or conductive polymers, aggregate and cement and having preset compressive strength, and pipes, tubes and capillaries.

GUARRERO B P

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Heat dissipating device, disposed on circuit board, comprises first glue layer, disposed on circuit board, first graphene composite heat dissipating layer, second glue layer, second graphene composite heat dissipating layer, and resin layer.

CHANG C F