国家/地区 世界知识产权组织（23）
IPC部 C（23）
IPC大类 C08（23）
IPC小类 C08K（15） C08L（12） H01M（10）
H05K（7） C08J（6） C09D（6）
C08F（5） C08G（5） H01B（5）
C01B（4） B82Y（3） C09K（3）
B01F（2） H01G（2） H01L（2）
IPC C08K003/04（11） H01M004/62（4） B82Y040/00（3）
C08K003/22（3） H05K009/00（3） C01B032/186（2）
C01B032/194（2） C08G063/08（2） C08K003/08（2）
C08L033/08（2） C09K005/14（2） H01B001/22（2）
H01L029/16（2） H01M004/139（2） H01M010/0565（2）
发明人 AKITO I（2） IBI A（2） KOZELJ M（2）
KYOICHI S（2） PARVOLE J（2） SHIROTA K（2）
公开年 2023（13） 2022（10）
申请年 2022（23）
专利权人 KAO CORP（2） SCE FRANCE（2）

Composition used for light emitting device for intelligent mobile phone, comprises poly(3,4-ethylene dioxythiophene), poly(styrene sulfonate) and sulfur ylide.

XIA S

Nanofield material composition used to prepare thermal interface which is used in field of LEDs, electronic devices, and heat sinks and heat pipes comprises carbon precursor, charge-conducting particles, polymer base, and additives.

NISTA S V G, MENDES L G, MOSHKALEV S, SAVU R

Producing thermally stabilized agglomerated lignin-carbon composite material, by providing agglomerated lignin-carbon composite material, and heating agglomerated lignin-carbon composite material to specific temperature to obtain thermally stabilized agglomerated lignin-carbon composite material.

OLSSON V, WALTER S, WACHTLER M, LINDSTROEM M

Two-part coating composition used to apply protective coating to surface of substrate, comprises part A having polyol, foam catalyst, gel catalyst, flame retardant, and water, and part B having e.g. isocyanate functional material.

ALLEN C, KINNER P, TURNER B G

Electromagnetic interference suppressing material used as radio wave absorber, noise suppression sheet, semiconductor sealing material, sealing sheet, and wire coating material, comprises base material containing organic substances and inorganic substances, and powdered carbon material.

NISHIHARA H, YOSHIDA S, UCHIDA K

Dispersant composition used in paste for positive electrodes of power storage device, comprises acrylic polymer having carbonyl-containing structural unit, amine compound having specific boiling point and organic solvent.

AKITO I, KYOICHI S, KAZUO O, IBI A, SHIROTA K, OKI K

Composition used for forming film heater, comprises binder resin containing resol phenolic resin, conductive particles comprising carbon nanotubes, adhesion enhancer comprising polyvinyl acetal, and heat resistance enhancer comprising silsesquioxane powder.

KIM Y J, YOU G J, JANG S H, KIM H J, PARK G H, HONG B K, YOONJIN K, YU G, HYUN C, PARK K H

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

New ethynyl benzene-based crosslinking precursor used for copolymer of gel polymer electrolyte used in electrochemical device.

KIM T H, KIM S H, JANG J K, LEE J Y, JANG J G

Anion conducting copolymer used in anion exchange membrane, comprises poly(phenylene) backbone having 9H-fluorene structure, and pair of side chains extending from center ring to respective terminal group, and aromatic compound coupled to poly(phenylene) backbone.

QIUYING Z, BAMDAD B