国家/地区 中国（3）
IPC部 B（4）
IPC大类 B21（4）
IPC小类 B21C（4）
IPC B21C001/00（2）
发明人
公开年 2023（4）
申请年 2022（4）
专利权人

Preparing graphene-doped copper bonding wire comprises taking graphene oxide, mixing with mixed metal powder to obtain molten mixed powder, placing semi-finished product wire into aqueous solution of reducing agent for heating, annealing, washing and drying.

FENG Z, QU S, LIU B, WANG T, LIN L

Palladium-silver-copper alloy wire rod for use in wafer testing, comprises palladium, silver, graphene copper, indium and unavoidable impurities.

CHUANG Y H, QIU L, CHAO C Y

Pipe body extrusion process of aluminum-magnesium alloy explosion-proof box, comprises e.g. placing aluminum-magnesium alloy in treatment modified solution for ultrasonic dispersion treatment, taking out and drying, performing extruding treatment, and straightening and correcting.

ZHANG J

Wire drawing lubricating oil useful for stainless steel wire drawing, obtained by taking aqueous lubricant as solvent, adding paraffin and nano-graphene in aqueous lubricant.

YAN P, SONG R, HU J