国家/地区
IPC部 B（3）
IPC大类 B23（3）
IPC小类 C22C（3）
IPC B23B027/14（2）
发明人
公开年 2023（3）
申请年 2022（3）
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Machining of titanium alloy with micro-groove textured cutting tool has different type of tool inserts like plain tool, triangle micro texture tool and triangle texture tool with solid lubricant using tungsten carbide chemical vapor deposition coated insert.

KAUR H, BALA A, SETHI G, CHAWLA K, BAHL A, SINGH J, PRADHAN S, SOPPA I

Material alloy cutter comprises base material layer and carburized layer, where carburized layer is arranged on surface of base material layer, and titanium-aluminum-silicon-nitrogen composite coating of graphene doping is deposited outside carburized layer.

ZHU X, YANG Z, YANG Y, LIU H, LING X