国家/地区 中国（3） 日本（2） 世界知识产权组织（2）
IPC部 C（4）
IPC大类 C01（4）
IPC小类 C01B（4）
IPC C01B032/194（4）
发明人
公开年 2021（4）
申请年 2021（4）
专利权人 MITSUBISHI M.（2）

Preparation method of graphene radiating film for electronic device, involves placing graphene after plating copper in mold, and completing production of graphene heat dissipation film by cold pressing and heat treatment.

CAI X, YANG X

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N

Use of silicon carbide whisker modified with fluorosilane coupling agent oligomer, for improving thermal conductivity of silicon carbide ceramic plate used for substrates of high-brightness LED light source.

ZHANG X, LING J, PAN T, BAI W