国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（4） C08J（2）
IPC C08K003/04（4）
发明人 CHEN Z（4）
公开年 2021（3）
申请年 2021（4）
专利权人

High heat-conducting, degradable shape memory composite material for electronic packaging, comprises crystal whisker, carbon material, biodegradable polyester and biodegradable elastomer, where crystal whisker and carbon material are uniformly dispersed in composite material.

LIU Y, HU G, ZHANG Y, CHEN Z, ZHANG X, SHI H

Graphene heat dissipation lamp for studying, comprises graphene composite thermally conducting plastic radiator comprising outer thermal conductive layer and inner thermal conductive layer and LED light source board mounted on radiator.

YAO L, TANG J, WANG K, CHEN Z

Resin-based composite material with high thermal conductivity comprises resin substrate, thermally conductive masterbatch, antioxidant, lubricant, reinforcing fiber and toughening agent.

ZHOU Y, CHEN Z, CHEN L, XIAO X, XU W, YU F

Mixing method for antistatic master batch preparation by soaking nano-zinc oxide in silane coupling agent water solution, taking out soaked nano-zinc oxide to dry, and putting polyester slice and processed nano-zinc oxide in open mill.

HU S, YANG X, LUO W, CHEN Z