国家/地区 世界知识产权组织（5） 韩国（3） 中国（2） 台湾（2） 美国（2）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C09D（6）
IPC C09D011/52（6）
发明人
公开年 2022（4） 2023（2）
申请年 2021（6）
专利权人

Manufacturing conductive ink useful in circuit board for next generation electronic device comprises e.g. mixing guar gum, xanthan gum, or hydroxyethyl cellulose with heated solvent, and mixing ethylene glycol, or propylene glycol.

HYOYOUNG M

Heating pad in heatable garment, comprises graphene particles dispersed in polymer matrix material, and electrically insulating covering layer bonded to heating pad and electrically insulating covering layer, overlaying and bonded to heating pad.

JONES E O, HOWE T H, SEYMOUR J

Method useful for e.g. depositing nanocomposite in e.g. solar application, involves stabilizing reduced graphene oxide with poly(sodium 4-styrenesulfonate), mixing conductive polymer and poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate) and electropolymerizing obtained solution onto electrode.

WAN SALIM W W A, BENOUDJIT A, SHOHIBUDDIN I U S

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Carbogenic nanoparticle-conducting polymer composite ink for thin film coated printed circuit board, dispersed in water, where carbogenic nanoparticle is reduced graphene oxide, and composite ink includes e.g. graphene oxide-polypyrrole composite ink and carbon quantum dots-polyaniline composite ink.

BHATTACHARJEE L, SHARMA A, MANNA U, GOEL A, PAL B, BESSEMER C

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S