国家/地区 中国（5）
IPC部 C（5） B（4） H（2）
IPC大类 C08（5）
IPC小类 C08K（5） C08L（4） C09K（3）
B32B（2） B82Y（2） C08G（2）
C08J（2） H01L（2）
IPC C08K003/013（5）
发明人
公开年 2021（3） 2022（2）
申请年 2021（5）
专利权人

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Intermediate film used for laminated glasses for automobiles, railroad vehicles, aircraft, ships, and buildings, contains pigment.

NOHARA A, CHOU K, NAKAYAMA K, OKAJIMA M, CHOW K, MOYURU O A, ZHANG J, YE Y

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R