国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3） C08L（3） C08J（2）
C09K（2）
IPC C08K003/38（3）
发明人 CHEN M（2） HUANG T（2） WU L（2）
公开年
申请年
专利权人 UNIV FUDAN（3）

Heat conducting framework with vertical orientation structure used in compact film material, comprises heat conducting filler which is induced to separate with polymer phase to obtain vertically oriented polymer/heat conducting filler porous framework.

WU L, HUANG T, CHEN M

Thermal interface material with vertical sandwich structure, comprises thermally conductive filler and polymer material with flexibility.

CHEN M, WU L, HUANG T

Preparation of epoxy-based composite material involves separately subjecting boron nitride/melamine composite sponge and graphene/melamine composite sponge to epoxy encapsulation perfusion, degassing, heating, curing and demolding.

WANG X, WU P