国家/地区 中国（8）
IPC部 C（8） B（3） G（2）
IPC大类 C08（8）
IPC小类 C08F（8） C08G（3） C08K（3）
C09D（3）
IPC C08F283/10（8）
发明人 LIU Z（2） WEI P（2）
公开年 2020（8）
申请年 2020（7） 
专利权人 JINLING INST.（2）

Formulation for improving electrode conductivity, comprises active functional monomer, acrylic acid, binder, graphene, carbon nanotubes, conductive carbon black, dissolving agent, electrode pole piece is made by above-mentioned components.

XU Y, CHEN C, ZHU C, CHEN Z, WU X, WANG X, ZHANG X

Graphene resin for solvent-free environmentally-friendly coating, is prepared by using epoxy resin, graphene polymer, organic acid, synthetic additive, polymerization inhibitor, styrene, curing accelerator, and diluent.

XUE J, ZHU L

Preparation of graphene/polyurethane-epoxy resin composite anticorrosive coating involves dispersing polyurethane-epoxy resin core-shell emulsion containing bisphenol A epoxy resin, slowly adding sulfonic acid-type graphene and stirring.

WEI P, LIU Z

Preparing graphene oxide/acrylate-epoxy resin composite anticorrosive coating involves preparing graphene oxide, acrylic acid modified epoxy resin intermediate shell phase monomer pre-emulsion, core phase emulsion and core-shell emulsion.

WEI P, LIU Z

Magnetically controlled 3D printing UV curable conductive material comprises oligomer, active monomer, magnetic nano-graphene, polymerization inhibitor and photoinitiator.

XIAO G, LIN G, JIAO X, LIN S, LI X, HUANG Q

Fluorinated epoxy acrylic resin coating comprises alkenylated silver oxide modified graphene, dodecafluoroheptyl (meth)acrylate, glycidyl (meth)acrylate, epoxy resin, (meth)acrylate, initiator, emulsifier, and curing agent.

ZHENG M

Graphene-modified waterborne acrylic acid grafted epoxy resin comprises epoxy resin, monomer, initiator, mixed solvent, neutralizer, graphene suspension, and distilled water.

SHEN W, LI J

Graphene-reinforced ceramic matrix composite material obtained by mixing graphene, photo-curing resiN and photoinitiator, adding ceramic powder, mixing dispersant, 3 dimentional photo-curing molding, slicing, degreasing and sintering.

LIU S, CAI W, LI Q